earticle

논문검색

Development of Machine Vision Monitoring System for Semiconductor Package Sorter

원문정보

초록

영어

The sorter working at high speed in semiconductor production process has been a main reason for productivity failure, causing equipment failure and process halt as socket full or full status of the semiconductor package is not monitor in loading and unloading work of the semiconductor package of test socket board. Furthermore, it is necessary to promptly control vacuum to load and unload semiconductor package at high speed, but delicate on/off control error and limitation of engineer's bare eye checking are not free form error to package sorting. Therefore, the present study developed sorter process-focused image (video) processing algorithm and hardware-based MVMS to apply to production lines.

목차

Abstract
 1. Introduction
 2. Composition of MVMS
  2.1. Sorter Motion Sequence and Operating Control Structure
  2.2. Hardware Block Diagram of the Developed Control Board
  2.3. Detailed Design and Dependence
  2.4. GUI Development and Signal Timing
 3. Algorithm Verification and Hardware Performance Evaluation
 4. Conclusion
 Acknowledgments
 References

저자정보

  • Hyoung-Keun Park Dept. of Electronic Engineering, Namseoul University

참고문헌

자료제공 : 네이버학술정보

    함께 이용한 논문

      ※ 원문제공기관과의 협약기간이 종료되어 열람이 제한될 수 있습니다.

      0개의 논문이 장바구니에 담겼습니다.