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Device and Module

Study on Nondestructive Analysis Techniques for Semiconductor Chips in Communication Device Development

초록

영어

Semiconductors are crucial components in communication technology, playing important roles in various communication systems. They are essential for signal processing, data transmission, and ensuring the stability of communication networks. In particular, high-performance semiconductor chipsets and processors enable ultra-fast data transmission and ultra-low latency in communication technology. For example, semiconductors are indispensable in smartphones, wireless networks, and satellite communication systems. For semiconductor packaging products, nondestructive internal analysis for defect analysis and process improvement without causing deformation of system packaging is an important part of the product development process. In this study, nondestructive analysis techniques using X-ray equipment are discussed. The results of this study can provide fast and accurate nondestructive analysis of semiconductor packaging products and can play a significant role in supporting the growth of the communication industry.

목차

Abstract
1. Introduction
2. Experiments and Discussions
3. Conclusion
Acknowledgement
References

저자정보

  • Yongho Choi Associate Professor, Department of Semiconductor Engineering, Jungwon University, Korea

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