원문정보
초록
영어
The objective of this research was to analyze the effect of hot-pressing temperature and Urea Formaldehyde (UF) and Methylene diphenyl diisocyanate (MDI) ratio on the physical and mechanical properties of particleboard. The first experiment was focused on pressing temperature treatment included 130, 140, 150, and 160oC. Particle is bonded using a combination of UF and MDI resin at a ratio of 70/30 (%w/w). Furthermore, the second experiment was focused on UF/MDI ratio treatment included of 100/0, 85/15, 70/30, 55/45 (% w/w). The particle was pressed at 140oC temperature. All of the particleboard in this research was produced in size of 25x25 cm2 using 12% resin content which target thickness and density were 1 cm and 0.75 g/cm3 respectively. Pressing time was determined to 10 minutes. Before the tests, the board was conditioned for 7 days. Good dimensional stability and mechanical properties were resulted by boards treated in 140oC temperature. The best ratio of UF/MDI was 55/45. The increase in the MDI adhesive ratio had an effect on the increase in MOE and MOR, however, the internal bond was in the contrary.