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함정탑재용 고발열 전자장비의 열적안정성 확보를 위한 수치적, 실험적 연구

원문정보

Numerical Analysis and Experimental Study to Required Thermal Stability of High Heat Electronic Equipment for Shipboard Application

이재훈, 정의봉 , 이건민, 이규송

피인용수 : 0(자료제공 : 네이버학술정보)

초록

영어

In this study, we performed thermal safety design of the electric module of a heat-loaded equipment with consideration of its heat dissipation performance. Initially, we calculated the heat dissipation of natural convection to choose a cooling method. Based on this, we found that some modules required forced convection and selected an air-cooling method with an outdoor temperature of 43 degrees Celsius, which is the maximum temperature in Korea. Prior to module production, we performed thermal analysis of each module and proceeded with a design to increase the thermal conductivity of the module as a primary step, and subsequently proceeded with Heat Sink design to maximize the heat dissipation performance. After considering various constraints according to the system requirements and designing the cooling path, we experimentally and analytically secured thermal safety at the operating temperature of the equipment.

목차

ABSTRACT
1. 서론
2. 본론
2.1 냉각 방식 선정
2.2 냉각 Path 설계
2.3 시스템 수치 해석적 접근
2.4 시스템 온도 시험
3. 결론
후기
References

저자정보

  • 이재훈 Jae-Hoon Lee . Mechanical Engineering R&D Lab, LIG Nex1 Co., Ltd.
  • 정의봉 Eui-Bong Jeong. Mechanical Engineering R&D Lab, LIG Nex1 Co., Ltd.
  • 이건민 Keon-Min Lee . Mechanical Engineering R&D Lab, LIG Nex1 Co., Ltd.
  • 이규송 Kyu-Song Lee . Agency for Defense Development

참고문헌

자료제공 : 네이버학술정보

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