원문정보
초록
영어
Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 ℃ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.
목차
1. INTRODUCTION
2. MATERIALS AND METHODS
2.1. REBCO tapes
2.2. Thermocompression equipment and procedures
2.3. Test measurement
3. RESULTS AND DISCUSSIONS
3.1. Microstructure of the copper diffusion joints
3.2. Keys to successful bonding
3.3. Electrical and mechanical characteristics
3.4. Comparison of three resistive joints of REBCO tapes
4. CONCLUSIONS
ACKNOWLEDGE
REFERENCES