earticle

논문검색

The design of large packaging production line system based on Embedded Technology

목차

Abstract
 1. Introduction
 2. Overall Scheme Design 
 3. System Hardware And Software Design 
  3.1. Minimum System Module and Peripheral Circuit of Single Chip MIcrocomputer
  3.2. 8255 Extension Module
  3.3. Input Circuit Module 
  3.4. Output Circuit Module
  3.5. Software Design
 4. The Test
  4.1. Debug of SCM System Module
  4.2. Research on Multi Axis Control Algorithm Based on Fuzzy PID
 5. The Results of the Experiment
 6. Conclusion
 References

저자정보

  • Huan Yang School of Mechanical Engineering, Hebei University of Technology, Tianjin, China
  • Qianqian Zhang School of Mechanical Engineering, Hebei University of Technology, Tianjin, China
  • Chenghao Yuan School of Mechanical Engineering, Hebei University of Technology, Tianjin, China
  • Hancheng zhao School of Mechanical Engineering, Hebei University of Technology, Tianjin, China
  • Yanjun Xiao School of Mechanical Engineering, Hebei University of Technology, Tianjin, China

참고문헌

자료제공 : 네이버학술정보

    함께 이용한 논문

      ※ 원문제공기관과의 협약기간이 종료되어 열람이 제한될 수 있습니다.

      0개의 논문이 장바구니에 담겼습니다.