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논문검색

Computer Simulation of Metal Surface Micro-Crack Inspection Using Pulsed Laser Thermography

초록

영어

Surface micro cracks are easy to produce in the preparation and service process of metal material, which impacts on the safe operation of metal components. Pulsed laser spot excitation and infrared thermal imaging technology are combined to detect metal surface micro-cracks. The working principle of laser infrared thermal imaging detection technology was described. The three dimensional heat conduction model of pulsed laser excitation flux transfer in metal plate was established, and calculated using finite element method (FEM). The results showed that, thermal flow in the image is a “D” shape. There are temperature differences between the sound regions and defective regions, and the defects experiences the process of obscure, gradually clear, and gradually obscure. Pulsed infrared thermography sequence was processed by polynomial fitting method, and the coefficient images effectively improve the contrast between defective and non-defective areas, which is beneficial to the determination and of recognition micro cracks.

목차

Abstract
 1. Introduction
 2. The Working Principle of Laser Infrared Thermal Imaging Detection Technology
 3. Presentation of the Heat Transfer Model
 4. FEM Simulation
  4.1 Temperature Distribution Caused by Laser Spot Source
  4.2 The Effect of Laser Beam Power
 5. The Processing of Thermography Sequence
 6. Conclusion
 Acknowledgment
 Reference

저자정보

  • Tang Qingju School of Mechanical Engineering, Heilongjiang University of Science and Technology, Harbin, 150022, P. R. China
  • Bu Chiwu College of Light Industry, Harbin University of Commerce, Harbin, 150028, P. R. China
  • Liu Yuanlin School of Mechanical Engineering, Heilongjiang University of Science and Technology, Harbin, 150022, P. R. China
  • Yu Fengyun School of Mechanical Engineering, Heilongjiang University of Science and Technology, Harbin, 150022, P. R. China
  • Zhao Yawei College of Engineering and Information Technology, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China

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