원문정보
초록
영어
The paper involves discovering how the power dissipation of arithmetic circuits on FPGAs changes with the ambient temperature. We have covered 90nm, 65nm, 45nm, 40nm and 28nm technology based FPGA. The goal of the paper is to analyze the Power dissipation of arithmetic circuits on 23 FPGAs for 4 different temperatures. This has been done by checking the power dissipation of FPGAs by connecting them to XPower Analyzer which is a utility for estimating the power consumption and junction temperature of FPGA devices. The devices were connected to the XPower Analyzer which calculated power dissipation on different temperature as well as the total average power consumption and generated a report. Also the Percentage reduction in power when ambient temperature is scaled down is calculated. We are getting 20-90% reduction in power consumption, when we are using the most energy efficient FPGA available.
목차
1. Introduction
3. Observations and Results
3.1 On Artix-7, Artix-7 Low Voltage, Automotive Artix-7, Automotive Spartan-3 A DSP, Automotive and Spartan-3 FPGA
3.2 On Automotive Spartan-3 A, Automotive Spartan-3 E, Automotive Spartan-6, Automotive Zynq, and Defense-Grade Artix-7 FPGA
3.3 On Defense-Grade Artix-7 Low Voltage, Kintex-7, Kintex-7 Low Voltage, Spartan-3 A DSP, and Spartan-3 FPGA
3.4 On Spartan-3 A and Spartan-3 AN, Spartan-3 E, Spartan-6, Spartan-6 Lower Power, and Virtex4 FPGA
3.5 On Virtex5, Virtex6 Lower Power, and Zynq FPGA
4. Conclusion
5. Future Scope
Acknowledgements
References