원문정보
보안공학연구지원센터(IJSIA)
International Journal of Security and Its Applications
Vol.9 No.6
2015.06
pp.271-278
피인용수 : 0건 (자료제공 : 네이버학술정보)
초록
영어
In this work, we are going to use thermal aware approach in Encoder design and also testing thermal stability by working on different ambient temperatures 298.15K, 308.15K, 318.15K, 328,15K, 338.15K and 348.15K and 358.15K. We have observe the compatibility of our device with wireless network by working on different I/O standards (LVCMOS15 and LVCMOS25) . There is 30.29% reduction in leakage power, when we scale down temperature from 358.15K to 298.15K using LVCMOS15 as I/O standard on 40nm Virtex FPGA. Leakage power is calculated for 65nm FPGA and 90nm FPGA as well .In this work, we are using Verilog Hardware Description Language.
목차
Abstract
1. Introduction
2. Thermal and Power Analysis
3. Conclusion
4. Future Scope
References
1. Introduction
2. Thermal and Power Analysis
3. Conclusion
4. Future Scope
References
키워드
저자정보
참고문헌
자료제공 : 네이버학술정보