earticle

영어

In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was 59℃ for thermoelectric device of the sheet copper structure and 67℃ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by 9℃ showed better heat radiation performance than those of the ceramic structure.

한국어

본 논문에서는 열전소자의 구조에 따른 COB LED의 방열성능을 비교 분석하였다. COB LED의 발열부분과 접 합하는 열전소자는 구리박판 구조와 세라믹 구조의 열전소자를 사용하였다. COB LED와 열전소자의 접합부분은 접촉식 온도계를 통해 온도 분포를 측정하였고, 각각의 열전소자는 0.1A, 0.3A, 0.5A, 0.7A의 전류를 입력시켜서 온도 변화를 측정하였다. COB LED의 열 응집현상이 나타나는 접합부분의 온도는 0.7A를 인가하였을 때 구리박판 구조의 열전소자 에서 59℃로 측정되었고, 세라믹 구조의 열전소자는 67℃로 나타났으며, 구리박판 열전소자가 세라믹 구조의 열전소자 보다 9℃가 낮게 측정됨으로써 방열성능이 더 우수함을 보였다.