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COF 리드 배열 집적도 향상을 위한 비선형 구조해석

원문정보

A Nonlinear Structural Analysis for Improvement of lead density in COF Bonding

황일선, 박상준, 라재성, 이영림

피인용수 : 0(자료제공 : 네이버학술정보)

초록

영어

In recent years, technology has been developed the way the volume of the portable communication device is reduced but its performance is maintained. The COF(Chip On Film) packaging method is used due to the densification of the lead pitch, especially for the display driver IC. During COF packaging, lead break and film detachment could occur by the high bonding temperature and pressure, and possibility for lead interference can emerge by deformation of leads. In this study, a new double-column arrangement of leads is considered to increase lead density further than the existing zigzag arrangement of leads, and nonlinear structural analysis was carried out to examine whether the interference can occur. The results showed that stress and deformation of the corner region appear relatively higher than those of central region, and interference did not occur by the lead strain for the double-column arrangement of leads with pitch of 25μm. Therefore, double-column lead arrangement can improve lead density by about 176% compared to the zigzag lead arrangement.

목차

Abstract
 1. 서론
 2. 수치해석
 3. 결과 및 고찰
  3.1 지그재그 리드패턴 COF 응력 및 변형량
  3.2 이중 리드 배열 COF 응력 및 변형량
 4. 결론
 후기
 References

저자정보

  • 황일선 Il Sun Hwang. 공주대학교 기계공학과 대학원
  • 박상준 Sang Jun Park. 공주대학교 기계공학과 대학원
  • 라재성 Jay Seong Ra. Samsung-Toray Electrics Company
  • 이영림 Young Lim Lee. 공주대학교 기계자동차공학부

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