Development and Analysis of Milling Model Coupled Thermal-Mechanical

Xiulin Sui; Xinyang Liu; Di Wang

Development and Analysis of Milling Model Coupled Thermal-Mechanical

원문정보

Xiulin Sui, Xinyang Liu, Di Wang

보안공학연구지원센터(IJSH) International Journal of Smart Home Vol.8 No.2 2014.03 pp.211-216

피인용수 : 0건 (자료제공 : 네이버학술정보)

Abstract
1. Introduction
2. Establishment the Milling Thermal-Elastic-Plastic Finite Element Equation
3. Establish the 3D Milling Simulation Model Based on Coupled Thermal-Mechanical
  3.1. Establish the 3D Milling Chip Separation Criteria–3D Stress Index
  3.2. Analysis of Tool-Chip Friction Type
  3.3. Development of 3D Coupled Thermal Conduction Model
  3.4 Wear Model of Tool
4. Analysis and Validation based on 3D Milling Simulation Coupled Thermal-Mechanical
5. Conclusion
Acknowledgments
References

키워드

저자정보

Xiulin Sui College of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin Heilongjiang150080, China
Xinyang Liu College of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin Heilongjiang150080, China
Di Wang College of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin Heilongjiang150080, China

참고문헌

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