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논문검색

An Improved Quad Flat Package for High Frequency SiP Applications

초록

영어

This paper describes four cascade coplanar transmission line structures built into the quad flat pack (QFP) lead frame for high-frequency system in package (SiP) applications. Adjacent ground leads are used to provide return paths in a coplanar configuration, thereby minimizing impedance mismatch. Due to the complexity level in QFP structure, full-wave electromagnetic simulations have been performed to extract the S-parameter. Time Domain Reflectometry (TDR) is also used to help in understanding the contributing to the SiP structure. The SiP has also been fabricated and good correlation with electromagnetic simulations is also achieved.

목차

Abstract
 1. Introduction
 2. Feasibility Analysis of the Coplanar Transmission Line Structure
 3. Construction of the Coplanar Transmission Line Structure
 4. The Improved QFP80 Lead Frame Design based on the Coplanar Transmission Line Structure
 5. High Performance SiP Design based on the Improved QFP Lead Frame
 6. Conclusions
 Acknowledgments
 References

저자정보

  • Haiyan Sun National ASIC System Engineering Research Center, Southeast University, Nanjing 210096, People’s Republic of China, Jiangsu Provincial Key Lab of ASIC Design, Nantong University, Nantong 226019, People’s Republic of China
  • Ling Sun Jiangsu Provincial Key Lab of ASIC Design, Nantong University, Nantong 226019, People’s Republic of China

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