earticle

영어

In this paper, we present a sequence analysis method, which is one of the advanced data mining techniques, to identify and extract unique patterns from wafer manufacturing data. Wafer fabrication in the semiconductor industry is one of the most complex manufacturing processes. For such highly complicated operations, maintaining high yields through the statistical process control as a sole monitoring method for quality control is obviously inefficient. We thus investigate the intelligent and semi-automatic technique to help industrial engineers analyzing their production data. Our proposed method has the ability to induce patterns that can reveal and differentiate low performance processes from the normal ones. We also provide program coding of the proposed sequence analysis method, implemented with the R language, for easy experimental repetition.