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Recently, Soldering of attaching electronic components(IC chip, Memory Board, etc.) on printed circuit board(PCB) is performed for reflow soldering process, which saves the process time and cost. On the other hand, the reflow soldering process has a bad effect on the thermal response of PCB. It may cause serious damages to the PCB, for example warpage of PCB and disconnection of copper patterns in PCB.
It is important to predict the thermal response of PCB during the reflow soldering process in order to avoid serious damages of PCB. As the result, this study is performed to understand the mechanism of a reflow equipment and to analyze factors of thermal imbalance of PCB which is affected by the air flow, the interaction between inner temperature of a reflow equipment and the coefficient of thermal conduction of FR-4&BT, the copper patterns of PCB, and so on. This study is performed to predict the thermal response of PCB by the factors of thermal imbalance which was simulated using the CFD tool ICEPAK. The results of this study can be used in minimizing the thermal imbalance of PCB by an optimally designing the PCB and reflow equipment conditions.