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Materials, Properties, and Electronic Devices

Bending Strain Dependence of the Transport Property in Jointed BSCCO Tapes

초록

영어

In this study, the effect of bending strain on the transport property and critical current of lap and butt-jointed (non-laminated) BSCCO tapes has been investigated. The samples were joined using a mechanically controlled jointing procedure. To achieve a uniform thickness at the joint a single point loading contact has been devised. GFRP mandrels with different bending radii which support the sample during bending have been used. Ic have been measured at 77 K and self field. In the case of easy bending test for jointed BSCCO tapes, sudden degradation of Ic is caused by the local strain concentration due to non uniform deformation at the edge parts of the joint. In the case of hard bending test of jointed BSCCO tapes transverse macroscopic crack at specific subsection caused a large Ic degradation. The transport property of jointed BSCCO tapes in each bending mode was discussed with the damage morphology occurred.

목차

Abstract
 1. INTRODUCTION
 2. EXPERIMENTALPROCEDURE
 3. RESULTS AND DlSCUSSION
 4. CONCLUSION
 REFERENCES

저자정보

  • Marlon J. Dedicatoria Department of Mechanical Design Engineering, Andong National University
  • Hyung-Seop Shin Department of Mechanical Design Engineering, Andong National University

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