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Contract-Based Software Component Testing with UML Models

초록

영어

Improving model-based component testability can further model-based approaches to software component testing (SCT) for desirable testing effectiveness. Component contracts are useful testing-support artefacts to improve component testability. This paper presents a new contract-based SCT technique, Test by Contract (TbC), which extends the Design by Contract concept to the SCT domain, and leverages UML-based testing with the contract mechanism to design model-based test contracts for UML-based SCT. We introduce a new concept of Contract for Testability as the principal goal of the TbC technique, and develop a set of important contract-oriented concepts (test contract, effectual contract scope, and internal/external test contract) and useful test criteria to improve model-based testability. We develop a useful stepwise TbC working process, and use a case study to demonstrate how to put the TbC technique into practice to undertake contract-based SCT with UML models.

목차

Abstract
 1. Introduction
 2. Software Component Testability and Improvement Approaches
  2.1. Software Component Testability
  2.2. Testability Improvement Approaches
 3. Overview of Test by Contract
 4. Contract for Testability
  4.1. Test Contract
  4.2. Realising and Representing Test Contracts
  4.3. Effectual Contract Scope – Internal/External Test Contract
  4.4. Contract-Based Test Criteria
  4.5. Realising Testability Improvement
 5. Test Contract Design for Test Model Construction
  5.1. Test Contract Design Strategy
  5.2. Contract-Based Test Model Construction – A Case Study
 6. Contract-Based Component Test Design
  6.1. Test Design with Test States
  6.2. Test Design with Test Events
 7. Contract-Based Component Test Generation
 8. Related Work and Discussion
 9. Conclusions and Future Work
 10. References

저자정보

  • Weiqun Zheng Centre for Intelligent Information Processing Systems, School of Electrical, Electronic and Computer Engineering, University of Western Australia
  • Gary Bundell Centre for Intelligent Information Processing Systems, School of Electrical, Electronic and Computer Engineering, University of Western Australia

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