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A solution ink of a silver complex was prepared by dissolving silver neodecanoate in xylene up to a concentration of 25% silver (Ag-SI). Spun-coated Ag-SI films were thermally decomposed to metallic silver films with resistivity values of less than 4.5× 10−5 Ω·cm, after sintering above 160oC. In addition, a silver nanoparticle ink (Ag-PI) could be prepared by removing a large amount of neodecanoic acid from the Ag-SI by reduction with phenylhydrazine. The sintering temperature for Ag-PI with a resistivity below 1×10−4 Ω ·cm was reduced from 160oC to 130oC by using Ag-PI instead of Ag-SI. However, Ag-PI was rather unstable, as a precipitation occurred in one week at room temperature. Finally, Ag-SI was tested for production of a metallic film on a polyamide as a metal complex ink in a drop-on-demand ink jet printer. The results indicated that it would be very suitable as a conducting ink.
