초록 열기/닫기 버튼
Bulk nanostructured copper was fabricated by a shock compaction method using the planar shock wavegenerated by a single gas gun system. Nano sized powders, average diameter of 100 nm, were compacted into the capsuleand target die, which were designed to eliminate the effect of undesired shock wave, and then impacted with analuminum alloy target at 400 m/s. Microstructure and mechanical properties of the shock compact specimen were analyzedusing an optical microscope (OM), scanning electron microscope (SEM), and micro indentation. Hardness resultsshowed low values (approximately 45~80 Hv) similar or slightly higher than those of conventional coarse grained commercialpurity copper. This result indicates the poor quality of bonding between particles. Images from OM and SEMalso confirmed that no strong bonding was achieved between them due to the insufficient energy and surface oxygenlayer of the powders.
